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eTissBone Void Fillers for Bone Loss and Defect Correction

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Cancellous and cortical bone chips with sound structural and mechanical properties for filling of bone loss and/or correcting of defects.

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  • eCOO® Technology processing ensures excellent osteoconductive properties
  • Forms stable complex with patient’s adjacent bone
  • Wide variety of general orthopaedic, spinal, and dental applications