Fatigue And Fracture Testing Equipment Supplied In Lithuania
1 equipment items found
Manufactured by:F&S BONDTEC Semiconductor GmbH based inBraunau, AUSTRIA
BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnection Test) is a completely new test method for estimating bond life and reliability of heavy wire wedge bonds. It is the perfect extension of the classic Power Cycling Test (PC): the cyclic stress of the wire bond due to temperature cycling is replicated by mechanical stress, but with significantly higher cycle speed. This allows PC ...